H10W 72/07211
Treating the bond pad before connecting
Official title: {Treating the bond pad before connecting, e.g. by applying flux or cleaning}
H10W72/07211 (Treating the bond pad before connecting) appears on 383 US grants and 447 published applications in this corpus.
Search patents in H10W- Granted patents
- 383
- Published applications
- 447
- Assignees
- 141
- Inventors
- 847
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 3 |
| 2002 | 4 | 4 |
| 2003 | 4 | 4 |
| 2004 | 4 | 3 |
| 2005 | 1 | 5 |
| 2006 | 6 | 4 |
| 2007 | 5 | 8 |
| 2008 | 1 | 7 |
| 2009 | 1 | 4 |
| 2010 | 8 | 3 |
| 2011 | 5 | 10 |
| 2012 | 4 | 17 |
| 2013 | 11 | 20 |
| 2014 | 12 | 36 |
| 2015 | 31 | 28 |
| 2016 | 27 | 32 |
| 2017 | 36 | 50 |
| 2018 | 37 | 34 |
| 2019 | 35 | 27 |
| 2020 | 22 | 23 |
| 2021 | 25 | 31 |
| 2022 | 23 | 27 |
| 2023 | 19 | 17 |
| 2024 | 27 | 21 |
| 2025 | 10 | 14 |
| 2026 | 9 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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By later US patents
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