Structures and methods for low temperature bonding using nanoparticles

An assembly, comprising:

• a first component including a substrate having a first surface and a plurality of first conductive elements exposed at the first surface, each first conductive element having a top surface generally facing in a first direction, the top surface of each first conductive element exposed in a recess extending below the first surface;
• and
• a second component including a substrate having a major surface and a plurality of second conductive elements exposed at the major surface, each second conductive element having a top surface generally facing in a second direction opposite the first direction, the top surface of each second conductive element exposed in a recess extending below the major surface,
• the first conductive elements being joined with the second conductive elements, such that the top surfaces of the first conductive elements at least partially confront the top surfaces of the second conductive elements,
• each first conductive element being electrically interconnected with a corresponding one of the second conductive elements by a bond region including impurities that show structural evidence of the use of conductive nanoparticles having long dimensions smaller than 100 nanometers in a joining process, each bond region penetrating at least partially into the first conductive element and the second conductive element,
• wherein at least one of the substrates of the first component and the second component has a metal element extending in a respective plane in first and second transverse directions within the respective substrate, the metal element configured to provide electromagnetic shielding to reduce signal noise of signals traveling between the first and second conductive elements.