TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) process

A bridge die, comprising:

• a die substrate;
• a plurality of vias through the die substrate;
• a first plurality of pads over a backside of the plurality of vias;
• a second plurality of pads over a front side of the plurality of vias, individual ones of the second plurality of pads having a width less than a width of individual ones of the first plurality of pads;
• a plurality of solder bumps on the first plurality of pads;
• and
• a non-conductive film (NCF) over the plurality of solder bumps.

An electronic system, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a cavity, the cavity having sloped sidewalls;
• a bridge die in the cavity, wherein a backside of the bridge die is coupled to pads in the cavity using a non-conductive film (NCF) around solder between the bridge die and the pads;
• a first die coupled to the package substrate;
• and
• a second die coupled to the package substrate, wherein the first die is communicatively coupled to the second die by the bridge die.