H10W 72/07261
With the bump connectors facing upwards, i.e. not in flip-chip orientation
Official title: {with the bump connectors facing upwards, i.e. not in flip-chip orientation}
H10W72/07261 (With the bump connectors facing upwards, i.e. not in flip-chip orientation) appears on 3 US grants and 4 published applications in this corpus.
Search patents in H10W- Granted patents
- 3
- Published applications
- 4
- Assignees
- 1
- Inventors
- 3
- Latest grant
- 30 Apr 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2021 | 1 | 2 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
By publication year.
Recent patents
- High density pillar interconnect conversion with stack to substrate connection30 Apr 2024US 11,973,062 B2Micron Technology, Inc.
- High density pillar interconnect conversion with stack to substrate connection21 Feb 2023US 11,587,912 B2Micron Technology, Inc.
- High density pillar interconnect conversion with stack to substrate connection10 Aug 2021US 11,088,114 B2Micron Technology, Inc.
- High density pillar interconnect conversion with stack to substrate connection22 Aug 2024US 2024/0282755 A1Micron Technology, Inc.
- High density pillar interconnect conversion with stack to substrate connection22 Jun 2023US 2023/0197689 A1Micron Technology, Inc.
- High density pillar interconnect conversion with stack to substrate connection11 Nov 2021US 2021/0351163 A1Micron Technology, Inc.
- High density pillar interconnect conversion with stack to substrate connection6 May 2021US 2021/0134759 A1Micron Technology, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.