H10W 72/07251
Characterised by changes in properties of the bump connectors during connecting
Official title: {characterised by changes in properties of the bump connectors during connecting}
H10W72/07251 (Characterised by changes in properties of the bump connectors during connecting) appears on 12,565 US grants and 13,210 published applications in this corpus.
Search patents in H10W- Granted patents
- 12,565
- Published applications
- 13,210
- Assignees
- 1,697
- Inventors
- 16,483
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 10 | 0 |
| 1981 | 6 | 0 |
| 1982 | 9 | 0 |
| 1983 | 4 | 0 |
| 1984 | 6 | 0 |
| 1985 | 7 | 0 |
| 1986 | 9 | 0 |
| 1987 | 15 | 0 |
| 1988 | 14 | 0 |
| 1989 | 19 | 0 |
| 1990 | 37 | 0 |
| 1991 | 29 | 0 |
| 1992 | 35 | 0 |
| 1993 | 54 | 0 |
| 1994 | 90 | 0 |
| 1995 | 74 | 0 |
| 1996 | 81 | 0 |
| 1997 | 86 | 0 |
| 1998 | 174 | 0 |
| 1999 | 208 | 0 |
| 2000 | 244 | 0 |
| 2001 | 326 | 167 |
| 2002 | 364 | 477 |
| 2003 | 420 | 470 |
| 2004 | 395 | 604 |
| 2005 | 415 | 687 |
| 2006 | 482 | 734 |
| 2007 | 467 | 725 |
| 2008 | 436 | 793 |
| 2009 | 426 | 760 |
| 2010 | 591 | 620 |
| 2011 | 624 | 542 |
| 2012 | 538 | 402 |
| 2013 | 490 | 473 |
| 2014 | 484 | 505 |
| 2015 | 468 | 606 |
| 2016 | 567 | 491 |
| 2017 | 499 | 463 |
| 2018 | 426 | 367 |
| 2019 | 389 | 459 |
| 2020 | 398 | 552 |
| 2021 | 373 | 559 |
| 2022 | 451 | 490 |
| 2023 | 452 | 418 |
| 2024 | 386 | 382 |
| 2025 | 326 | 324 |
| 2026 | 142 | 140 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) process6 Oct 2026US 12,757,761 B2Intel Corporation
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor chip, chip stacked structure and semiconductor package including the same8 Oct 2026US 2026/0314405 A1Samsung Electronics Co., Ltd.
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor package including connection bump8 Oct 2026US 2026/0314471 A1Samsung Electronics Co., Ltd.
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017