H10W 72/07252
Changes in structures or sizes
Official title: {changes in structures or sizes}
H10W72/07252 (Changes in structures or sizes) appears on 1,555 US grants and 1,943 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,555
- Published applications
- 1,943
- Assignees
- 345
- Inventors
- 2,820
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 5 |
| 2002 | 6 | 16 |
| 2003 | 9 | 10 |
| 2004 | 11 | 30 |
| 2005 | 10 | 40 |
| 2006 | 31 | 20 |
| 2007 | 19 | 27 |
| 2008 | 17 | 26 |
| 2009 | 19 | 34 |
| 2010 | 22 | 26 |
| 2011 | 36 | 39 |
| 2012 | 28 | 46 |
| 2013 | 25 | 51 |
| 2014 | 46 | 90 |
| 2015 | 82 | 136 |
| 2016 | 122 | 126 |
| 2017 | 121 | 117 |
| 2018 | 105 | 100 |
| 2019 | 99 | 137 |
| 2020 | 110 | 139 |
| 2021 | 95 | 154 |
| 2022 | 120 | 158 |
| 2023 | 112 | 131 |
| 2024 | 124 | 147 |
| 2025 | 122 | 96 |
| 2026 | 46 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Memory device and method of assembling same22 Sep 2026US 12,745,632 B2SanDisk Technologies LLC
- Semiconductor package15 Sep 2026US 12,740,488 B2Samsung Electronics Co., Ltd.
- Package comprising a substrate with an interconnect block8 Sep 2026US 12,733,095 B2QUALCOMM Incorporated
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Semiconductor die package and methods of manufacturing8 Oct 2026US 2026/0314505 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package1 Oct 2026US 2026/0305477 A1Samsung Electronics Co., Ltd.
- Semiconductor package1 Oct 2026US 2026/0305485 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- III-Phospide and III-Arsenide flip chip light-emitting devices299US 6,784,463 B2Lumileds Lighting U.S., LLC · 2004
- LED illumination apparatus and card-type LED illumination source287US 6,949,772 B2Matsushita Electric Industrial Co., Ltd. · 2005
- Semiconductor device and method of manufacturing semiconductor device273US 7,402,901 B2Sony Corporation · 2008
- Image display unit and method of producing image display unit266US 6,613,610 B2Sony Corporation · 2003