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US 12,745,632 B2Granted
Memory device and method of assembling same
AssigneeSanDisk Technologies LLC
InventorsChee Seng Wong, Yoong Tatt Chin, Wei Chiat Teng
Life of this patent
Estimating the term…
Abstract
Technology for a memory device having memory dies flip-chip bonded to one or more interposers that are mounted to a system board is disclosed. The memory device may be an SSD and the system board may be an M.2 board. A memory controller die may be bonded to one of the interposer boards. In one aspect, the memory controller die is flip-chip bonded to the interposer board. In one aspect, a heat sink is attached to a top surface of the flip-chip bonded controller die and to top surfaces of a group of the memory dies. Neither the memory dies nor the interposers are covered with a mold compound. Performance of the memory device is improved by, for example, lower inductance and improved heat dissipation.
Claims15
A memory device comprising:
- a system board having an interface configured to connect to a host, the system board has a first major surface and a second major surface;
- a plurality of interposer boards directly mounted to the system board, at least one of the interposer boards is directly mounted to the first major surface, at least one of the interposer boards is directly mounted to the second major surface, wherein each interposer board comprises a plurality of conductance patterns, each conductance pattern including a cluster of contact pads, wherein neither the plurality of interposer boards nor the system board are covered with a mold compound;
- and
- a plurality of memory dies flip-chip bonded to each interposer board, wherein the plurality of memory dies are bare dies, wherein each memory die comprises memory cells, wherein each memory die comprises a cluster of bump pads on a face of the memory die, wherein for each particular memory die the cluster of bump pads of the particular memory die are electrically bonded to the cluster of contact pads of one of the conductance patterns of the interposer board.
1 more element
A method for assembling a solid state drive (SSD), the method comprising:
- flip-chip bonding a first group of bare memory dies directly to a primary side of a first interposer board, wherein the first interposer board comprises a plurality of conductance patterns, each conductance pattern including a cluster of contact pads, wherein each memory die in the first group comprises a cluster of bump pads on a face of the memory die, the flip-chip bonding the first group including for each particular memory die electrically bonding the cluster of bump pads of the particular memory die to the cluster of contact pads of one of the conductance patterns of the interposer board;
- flip-chip bonding a second group of bare memory dies directly to a secondary side of the first interposer board, wherein each memory die in the first group and the second group comprises non-volatile memory cells, wherein each memory die in the second group comprises a cluster of bump pads on a face of the memory die, the flip-chip bonding the second group including for each particular memory die electrically bonding the cluster of bump pads of the particular memory die to the cluster of contact pads of one of the conductance patterns of the first interposer board;
- flip-chip bonding a third group of bare memory dies directly to a primary side of a second interposer board, wherein the second interposer board comprises a plurality of conductance patterns, each conductance pattern including a cluster of contact pads, wherein each memory die in the third group comprises a cluster of bump pads on a face of the memory die, the flip-chip bonding the first group including for each particular memory die electrically bonding the cluster of bump pads of the particular memory die to the cluster of contact pads of one of the conductance patterns of the second interposer board;
- mounting the first interposer board directly to a first major surface of a system board having an interface configured to connect to a host;
- and
- mounting the second interposer board directly to a second major surface of the system.
3 more elements
A solid state drive (SSD), the SSD comprising:
- a substrate means including substrate contact means for providing an electrical contact to the substrate means, the substrate means including means for connecting to and transferring data between the SSD and a host, the system substrate means has a first major surface and a second major surface;
- a plurality of interposer means directly mounted to the substrate means, at least one of the interposer means is directly mounted to the first major surface, at least one of the interposer means is directly mounted to the second major surface, wherein each of the interposer means comprises a plurality of first clusters of interposer-die contact means on a primary side of the interposer means and a plurality of second clusters of interposer-die contact means on a secondary side of the interposer means, wherein each of the interposer means comprises interposer-substrate contact means on the secondary side of the interposer means, wherein the interposer-substrate contact means are directly connected to the substrate contact means, wherein neither the plurality of interposer means nor the substrate means are covered with a mold compound;
- and
- a plurality of bare memory dies each comprising non-volatile memory cells, wherein each memory die comprises a cluster of die bond means on a face of the memory die, the plurality of memory dies comprising a first set of memory dies each having the face directly mounted to the primary side of one of the plurality of interposer means with the cluster of die bond means electrically bonded to a particular cluster of the first clusters of interposer-die contact means, the plurality of memory dies comprising a second set of memory dies each having the face directly mounted to the secondary side of one of the plurality of interposer means with the die bond means electrically bonded to a particular cluster of the second clusters of interposer-die contact means.
1 more element
Dependencies are inferred from the claim text.