H10W 72/07254
Changes in dispositions
Official title: {changes in dispositions}
H10W72/07254 (Changes in dispositions) appears on 3,701 US grants and 4,374 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,701
- Published applications
- 4,374
- Assignees
- 558
- Inventors
- 5,108
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 7 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 11 | 0 |
| 2000 | 5 | 0 |
| 2001 | 20 | 10 |
| 2002 | 11 | 23 |
| 2003 | 24 | 17 |
| 2004 | 16 | 19 |
| 2005 | 13 | 30 |
| 2006 | 13 | 27 |
| 2007 | 14 | 37 |
| 2008 | 17 | 58 |
| 2009 | 24 | 44 |
| 2010 | 39 | 62 |
| 2011 | 60 | 86 |
| 2012 | 72 | 121 |
| 2013 | 92 | 163 |
| 2014 | 150 | 217 |
| 2015 | 209 | 349 |
| 2016 | 305 | 298 |
| 2017 | 285 | 300 |
| 2018 | 266 | 242 |
| 2019 | 251 | 324 |
| 2020 | 281 | 399 |
| 2021 | 262 | 392 |
| 2022 | 321 | 341 |
| 2023 | 333 | 260 |
| 2024 | 266 | 248 |
| 2025 | 229 | 221 |
| 2026 | 83 | 86 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) process6 Oct 2026US 12,757,761 B2Intel Corporation
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Memory device and method of assembling same22 Sep 2026US 12,745,632 B2SanDisk Technologies LLC
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor package including connection bump8 Oct 2026US 2026/0314471 A1Samsung Electronics Co., Ltd.
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Semiconductor package1 Oct 2026US 2026/0305485 A1Samsung Electronics Co., Ltd.
- Semiconductor structure, semiconductor package, and method for forming semiconductor structure17 Sep 2026US 2026/0283006 A1CXMT Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017