H10W 72/07253
Changes in shapes
Official title: {changes in shapes}
H10W72/07253 (Changes in shapes) appears on 1,049 US grants and 1,258 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,049
- Published applications
- 1,258
- Assignees
- 288
- Inventors
- 2,073
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 7 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 7 |
| 2002 | 4 | 12 |
| 2003 | 10 | 7 |
| 2004 | 7 | 12 |
| 2005 | 5 | 10 |
| 2006 | 6 | 14 |
| 2007 | 7 | 7 |
| 2008 | 13 | 19 |
| 2009 | 10 | 22 |
| 2010 | 16 | 20 |
| 2011 | 13 | 29 |
| 2012 | 20 | 35 |
| 2013 | 33 | 54 |
| 2014 | 47 | 78 |
| 2015 | 70 | 131 |
| 2016 | 95 | 83 |
| 2017 | 99 | 94 |
| 2018 | 84 | 59 |
| 2019 | 62 | 62 |
| 2020 | 58 | 93 |
| 2021 | 50 | 82 |
| 2022 | 78 | 82 |
| 2023 | 73 | 74 |
| 2024 | 62 | 77 |
| 2025 | 60 | 60 |
| 2026 | 25 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Microelectronic assemblies with direct bonding using nanotwinned copper15 Sep 2026US 12,740,454 B2Intel Corporation
- Integrated circuit package heat sink8 Sep 2026US 12,733,492 B2STMicroelectronics (Grenoble 2) SAS
- Semiconductor package with exposed electrical contacts8 Sep 2026US 12,733,516 B2Stmicroelectronics Pte Ltd
- Electronic device8 Sep 2026US 12,733,524 B2Advanced Semiconductor Engineering, Inc.
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor package including connection bump8 Oct 2026US 2026/0314471 A1Samsung Electronics Co., Ltd.
- Multi-wafer bonding for nand scaling1 Oct 2026US 2026/0305424 A1SanDisk Technologies LLC
- Semiconductor package1 Oct 2026US 2026/0305485 A1Samsung Electronics Co., Ltd.
- Manufacture of electronic chips24 Sep 2026US 2026/0293781 A1STMicroelectronics (Tours) SAS
Most cited
By later US patents
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Bump structure, bump forming method and package connecting body200US 6,229,220 B1International Business Machines Corporation · 2001
- Semiconductor device and process for producing the same163US 4,764,804 AHitachi, Ltd. · 1988
- Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same156US 8,064,224 B2Intel Corporation · 2011