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US 2026/0293781 A1Published application
Manufacture of electronic chips
AssigneeSTMicroelectronics (Tours) SAS
InventorsOlivier ORY, Michael DE CRUZ
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Abstract
The present disclosure relates to an electronic chip comprising a semiconductor substrate carrying at least one metal contact extending, within the thickness of the substrate, along at least one flank of the chip.
Claims20
A method, comprising:
- forming a plurality of first openings extending through an interconnect layer on a substrate and extending into the substrate;
- forming an insulating material in the plurality of first openings
- covering the insulating material with a conductive material by forming a conductive material in the plurality of first openings;
- forming a plurality of conductive bumps on the conductive material, each one of the conductive bumps covering at least two adjacent ones of a plurality of contact connection pads of the interconnect layer;
- and
- forming a plurality of trenches extending through the conductive bumps, through the conductive material, and into the substrate by removing portions of the conductive bumps, the conductive layer, and the substrate.
3 more elements
A method, comprising:
- forming a plurality of first openings extending through an interconnect layer on a substrate and extending into the substrate;
- forming a photosensitive layer in the plurality of first openings and on the interconnect layer;
- forming a plurality of second openings in the photosensitive layer by removing portions of the photosensitive layer;
- forming an insulating material in the plurality of second openings;
- covering the insulating material with a conductive material by forming the conductive material in the plurality of second openings;
- and
- forming a plurality of conductive bumps on the conductive material, each one of the conductive bumps covering at least two adjacent ones of a plurality of contact connection pads of the interconnect layer.
4 more elements
A method of manufacturing an electronic chip, the method comprising:
- forming a plurality of first openings extending into a first side a semiconductor substrate and extending through an interconnect stack on the first side the semiconductor substrate, wherein the interconnect stack includes a plurality of contact connection pads;
- filling the plurality of first openings with a photosensitive resin layer;
- forming a plurality of second openings in the photosensitive resin layer within the plurality of first openings;
- depositing an insulation layer that partially fills the plurality of second openings and that lines respective sidewalls of the semiconductor substrate that define the plurality of second openings, sidewalls the interconnect stack that define the plurality of second openings, and respective sidewalls and surfaces of the photosensitive resin layer that define the plurality of second openings;
- forming a plurality of metal portions on the insulation layer and at least partially filling the plurality of second openings;
- forming a plurality of bumps on the plurality of metal portions and on the plurality of contact connection portions;
- removing the photosensitive resin layer such that the plurality of bumps extend across the plurality of first openings;
- depositing a protective insulating resin layer on the plurality of bumps and filling respective portions of the plurality of first openings exposed by removing the photosensitive resin layer;
- planarizing the protective insulating resin layer and the plurality of bumps;
- thinning the semiconductor substrate
- depositing a protective resin layer on a second side of the semiconductor substrate opposite to the first side of the semiconductor substrate;
- and
- singulating along the plurality of first openings forming one or more electronic chips having at least one flank along which a metal contact is exposed.
10 more elements
Dependencies are inferred from the claim text.