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US 8,064,224 B2Granted
Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
AssigneeIntel Corporation
InventorsRavi Mahajan, Sandeep Sane
Life of this patent
Estimating the term…
Abstract
A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive line (150) in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.
Claims20
A microelectronic package comprising:
- a substrate;
- a silicon patch embedded in the substrate;
- a first interconnect structure at a first location of the silicon patch and a second interconnect structure at a second location of the silicon patch;
- and
- an electrically conductive line in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.
2 more elements
A microelectronic package comprising:
- a substrate;
- a first die and a second die over the substrate;
- a silicon patch embedded in the substrate;
- a first plurality of interconnect structures in the silicon patch underneath the first die and a second plurality of interconnect structures in the silicon patch underneath the second die;
- and
- an electrically conductive line connecting a first one of the first plurality of interconnect structures and a first one of the second plurality of interconnect structures to each other.
3 more elements
A method of manufacturing a microelectronic package, the method comprising:
- providing a substrate having a silicon patch embedded therein;
- forming a first interconnect structure at a first location of the silicon patch and a second interconnect structure at a second location of the silicon patch;
- and
- electrically connecting the first interconnect structure and the second interconnect structure to each other.
1 more element
Dependencies are inferred from the claim text.