Semiconductor package with exposed electrical contacts

A package, comprising:

• a die having a first surface and a second surface opposite to the first surface;
• a redistribution layer on the first surface of the die;
• a plurality of conductive extensions on the redistribution layer, each of the plurality of conductive extensions including a top surface on the redistribution layer, a bottom surface opposite to the top surface, and a sidewall between the top surface and the bottom surface;
• a lamination layer on the first surface of the die and on at least a portion of the redistribution layer;
• an aperture in the lamination layer at an interface between at least one of the plurality of conductive extensions and the lamination layer, the bottom surface;
• and
• a plating layer on at least one of the plurality of conductive extensions,
• wherein:
• the plating layer is on the bottom surface and at least a portion of the sidewall of the at least one of the plurality of conductive extensions;
• and
• the aperture extends around less than an entirety of a perimeter of the at least one plurality of conductive extensions.

A package, comprising:

• a die having a first surface and a second surface opposite to the first surface;
• a plurality of conductive extensions on the first surface of the die, each of the plurality of conductive extensions including a top surface, a bottom surface, and a sidewall between the top surface and the bottom surface;
• a lamination layer on the first surface of the die;
• a plurality of channels in the lamination layer, each channel being between the sidewall of a corresponding conductive extension and an internal sidewall of the lamination layer;
• and
• a plating layer on the bottom surface and at least a portion of the sidewall of at least one of the plurality of conductive extensions,
• wherein at least one of the plurality of channels extends around less than an entirety of a perimeter of the corresponding conductive extension.