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US 12,733,492 B2Granted
Integrated circuit package heat sink
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsRomain Coffy, Jerome Lopez
Life of this patent
Estimating the term…
Abstract
An integrated circuit includes an electronic chip having a face covered with a thermal interface material layer. A heat sink includes a mounting area fixed to the chip via the thermal interface material layer. The heat sink includes open notches extending into the mounting area to delimit fins separated from each other by the open notches.
Claims24
An integrated circuit device, comprising:
- an electronic integrated circuit chip having a first face and a second face;
- a thermal interface material layer covering the first face;
- and
- a heat sink comprising a mounting area fixed to the electronic integrated circuit chip via the thermal interface material layer;
- wherein the heat sink comprises open notches extending into the mounting area to form a plurality of fins separated from each other by the open notches;
- wherein the heat sink further comprises a peripheral region and wherein the open notches comprise radial notches extending between a central region of the mounting area and the peripheral region of the heat sink;
- and
- wherein the open notches further comprise peripheral notches extending from ends of the radial notches in a position between the mounting area and the peripheral region.
5 more elements
An integrated circuit device, comprising:
- an electronic integrated circuit chip having a first face and a second face;
- a thermal interface material layer covering the first face;
- and
- a heat sink comprising a mounting area fixed to the electronic integrated circuit chip via the thermal interface material layer;
- wherein the heat sink comprises open notches extending into the mounting area to form a plurality of fins separated from each other by the open notches;
- wherein the heat sink further comprises a peripheral region and wherein the open notches comprise radial notches extending between a central region of the mounting area and the peripheral region of the heat sink;
- and
- wherein the fins are connected to each other at the central region of the mounting area and are connected to the peripheral region by connecting tabs extending across a width of the peripheral notches.
5 more elements
A heat sink for mounting to an electronic integrated circuit chip, comprising:
- a mounting region having an upper face and a lower face;
- and
- a peripheral region surrounding the mounting region;
- a plurality of first open notches extending through the mounting region to define a plurality fins;
- and
- a plurality of second open notches extending between the mounting region and the peripheral region;
- wherein the fins are connected to the peripheral region by connecting tabs extending across a width of the second open notches.
4 more elements
A heat sink for mounting to an electronic integrated circuit chip, comprising:
- a mounting region having an upper face and a lower face;
- and
- a peripheral region surrounding the mounting region;
- a plurality of first open notches extending through the mounting region to define a plurality fins;
- and
- a plurality of second open notches extending between the mounting region and the peripheral region;
- wherein each first open notch comprises a radial notch extending between a center of the mounting region and the peripheral region;
- and
- wherein each second open notch extends from an end of the radial notch.
6 more elements
A heat sink for mounting to an electronic integrated circuit chip, comprising:
- a mounting region having an upper face and a lower face;
- and
- a peripheral region surrounding the mounting region;
- a plurality of first open notches extending through the mounting region to define a plurality fins;
- and
- a plurality of second open notches extending between the mounting region and the peripheral region;
- wherein each first open notch comprises a radial notch extending between a center of the mounting region and the peripheral region;
- and
- wherein the fins are connected to each other at the center of the mounting region.
6 more elements
An integrated circuit device, comprising:
- an electronic integrated circuit chip having a first face and a second face;
- a thermal interface material layer covering the first face;
- and
- a heat sink comprising a plate having an upper surface and a lower surface, wherein the lower surface is fixed to the first face of the electronic integrated circuit chip via the thermal interface material layer;
- wherein the plate of the heat sink comprises first notches extending in depth completely through a thickness of the plate from the upper surface to the lower surface and extending in length outwardly from a central region of the heat sink to a peripheral region of the heat sink;
- wherein the first notches extend radially;
- and
- wherein the plate of the heat sink further comprises second notches extending in depth completely through the thickness of the plate from the upper surface to the lower surface and extending in length away from distal ends of the first notches.
5 more elements
Dependencies are inferred from the claim text.