H10W 72/07202
Using auxiliary members
Official title: {using auxiliary members}
H10W72/07202 (Using auxiliary members) appears on 2,562 US grants and 3,127 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,562
- Published applications
- 3,127
- Assignees
- 421
- Inventors
- 3,195
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 4 |
| 2002 | 5 | 8 |
| 2003 | 6 | 12 |
| 2004 | 10 | 15 |
| 2005 | 10 | 13 |
| 2006 | 7 | 31 |
| 2007 | 10 | 33 |
| 2008 | 10 | 35 |
| 2009 | 25 | 38 |
| 2010 | 23 | 47 |
| 2011 | 40 | 66 |
| 2012 | 53 | 84 |
| 2013 | 69 | 83 |
| 2014 | 86 | 131 |
| 2015 | 90 | 139 |
| 2016 | 131 | 137 |
| 2017 | 173 | 210 |
| 2018 | 190 | 215 |
| 2019 | 228 | 265 |
| 2020 | 218 | 309 |
| 2021 | 219 | 307 |
| 2022 | 226 | 329 |
| 2023 | 241 | 207 |
| 2024 | 228 | 201 |
| 2025 | 190 | 153 |
| 2026 | 59 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells8 Sep 2026US 12,732,193 B2iCometrue Company Ltd.
- Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells1 Sep 2026US 12,726,202 B2iCometrue Company Ltd.
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Bonding scheme for semiconductor packaging18 Aug 2026US 12,713,957 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package with organic interposer11 Aug 2026US 12,708,009 B2Samsung Electronics Co., Ltd.
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells1 Oct 2026US 2026/0303097 A1iCometrue Company Ltd.
- Semiconductor package and manufacturing method thereof10 Sep 2026US 2026/0271788 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with bridge die and method of forming the same27 Aug 2026US 2026/0255994 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Three-dimensional chip stacking assembly678US 6,355,501 B1International Business Machines Corporation · 2002
- Chip and wafer integration process using vertical connections388US 6,599,778 B2International Business Machines Corporation · 2003