H10W 72/07204
Using temporary auxiliary members
Official title: {using temporary auxiliary members, e.g. sacrificial coatings}
H10W72/07204 (Using temporary auxiliary members) appears on 2,382 US grants and 2,901 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,382
- Published applications
- 2,901
- Assignees
- 382
- Inventors
- 2,903
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 3 |
| 2002 | 5 | 8 |
| 2003 | 6 | 11 |
| 2004 | 9 | 14 |
| 2005 | 10 | 13 |
| 2006 | 7 | 30 |
| 2007 | 10 | 32 |
| 2008 | 9 | 35 |
| 2009 | 23 | 35 |
| 2010 | 23 | 45 |
| 2011 | 40 | 61 |
| 2012 | 48 | 73 |
| 2013 | 65 | 77 |
| 2014 | 81 | 108 |
| 2015 | 75 | 119 |
| 2016 | 114 | 119 |
| 2017 | 152 | 188 |
| 2018 | 173 | 204 |
| 2019 | 213 | 250 |
| 2020 | 205 | 294 |
| 2021 | 210 | 292 |
| 2022 | 214 | 310 |
| 2023 | 231 | 200 |
| 2024 | 217 | 192 |
| 2025 | 179 | 140 |
| 2026 | 55 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells8 Sep 2026US 12,732,193 B2iCometrue Company Ltd.
- Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells1 Sep 2026US 12,726,202 B2iCometrue Company Ltd.
- Semiconductor package with organic interposer11 Aug 2026US 12,708,009 B2Samsung Electronics Co., Ltd.
- Semiconductor device, package structure and method of fabricating the same11 Aug 2026US 12,708,011 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method4 Aug 2026US 12,698,369 B2
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells1 Oct 2026US 2026/0303097 A1iCometrue Company Ltd.
- Semiconductor package and manufacturing method thereof10 Sep 2026US 2026/0271788 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with bridge die and method of forming the same27 Aug 2026US 2026/0255994 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Three-dimensional chip stacking assembly678US 6,355,501 B1International Business Machines Corporation · 2002
- Chip and wafer integration process using vertical connections388US 6,599,778 B2International Business Machines Corporation · 2003
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014