H10W 72/07207
Temporary substrates
Official title: {Temporary substrates, e.g. removable substrates}
H10W72/07207 (Temporary substrates) appears on 1,950 US grants and 2,368 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,950
- Published applications
- 2,368
- Assignees
- 295
- Inventors
- 2,267
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 2 |
| 2002 | 3 | 6 |
| 2003 | 4 | 7 |
| 2004 | 6 | 8 |
| 2005 | 7 | 8 |
| 2006 | 5 | 10 |
| 2007 | 4 | 14 |
| 2008 | 4 | 22 |
| 2009 | 13 | 20 |
| 2010 | 14 | 31 |
| 2011 | 21 | 33 |
| 2012 | 28 | 54 |
| 2013 | 42 | 58 |
| 2014 | 59 | 89 |
| 2015 | 59 | 95 |
| 2016 | 99 | 102 |
| 2017 | 130 | 162 |
| 2018 | 151 | 179 |
| 2019 | 181 | 212 |
| 2020 | 182 | 273 |
| 2021 | 190 | 233 |
| 2022 | 181 | 254 |
| 2023 | 189 | 170 |
| 2024 | 179 | 166 |
| 2025 | 149 | 118 |
| 2026 | 46 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells8 Sep 2026US 12,732,193 B2iCometrue Company Ltd.
- Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells1 Sep 2026US 12,726,202 B2iCometrue Company Ltd.
- Semiconductor package with organic interposer11 Aug 2026US 12,708,009 B2Samsung Electronics Co., Ltd.
- Semiconductor device, package structure and method of fabricating the same11 Aug 2026US 12,708,011 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method4 Aug 2026US 12,698,369 B2
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells1 Oct 2026US 2026/0303097 A1iCometrue Company Ltd.
- Semiconductor package and manufacturing method thereof10 Sep 2026US 2026/0271788 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with bridge die and method of forming the same27 Aug 2026US 2026/0255994 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Chip and wafer integration process using vertical connections388US 6,599,778 B2International Business Machines Corporation · 2003
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Semiconductor package and method for fabricating the same314US 6,395,578 B1Amkor Technology, Inc. · 2002