Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method

A resin composition for temporarily fixing a support for substrate conveyance to an organic substrate, the resin composition comprising a thermoplastic resin, a thermosetting resin, a filler, a curing accelerator, and either containing no silicone-based release agent or having a content of a silicone-based release agent of 10% by mass or less based on a total amount of the resin composition,

• wherein the filler is an inorganic and/or organic filler, and a content of the filler in the resin composition is 5-300 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
• the thermoplastic resin consists of a (meth)acrylic copolymer having a crosslinkable epoxy group, a Tg of −50° C. to 50° C., and a weight average molecular weight of 100000 to 400000,
• the thermosetting resin consists of an epoxy resin,
• the resin composition for temporary fixing further comprises an epoxy resin curing agent that cures the epoxy resin, the epoxy resin curing agent consisting of a phenol resin,
• the combined content of the thermoplastic resin, the thermosetting resin, the filler, the curing accelerator, and the epoxy resin curing agent is 90% by mass or more based on the total amount of the resin composition,
• the content of the thermosetting resin in the resin composition is 10 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
• the curing accelerator consists of an imidazole,
• the content of the curing accelerator in the resin composition is 0.01 to 5.0 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermosetting resin, and
• wherein when the resin composition is formed into a film shape, the film has a shear viscosity at 60° C. of 100 to 10000 Pa·s, an elastic modulus of 10 to 1000 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 1 hour at 170° C., and a 5% weight reduction temperature of 300° C. or higher after being heated for 30 minutes at 130° C. and for 1 hour at 170° C.

A support tape for substrate conveyance, comprising:

• a support film for conveying an organic substrate;
• and
• a temporary fixing material layer provided on the support film for temporarily fixing the organic substrate and the support film,
• wherein the temporary fixing material layer comprises a thermoplastic resin, a thermosetting resin, a filler, a curing accelerator, and either contains no silicone-based release agent or has a content of a silicone-based release agent of 10% by mass or less based on a total amount of the temporary fixing material layer,
• the filler is an inorganic and/or organic filler, and a content of the filler in the temporary fixing material layer is 5-300 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
• the thermoplastic resin consists of a (meth)acrylic copolymer having a crosslinkable epoxy group, a Tg of −50° C. to 50° C., and a weight average molecular weight of 100000 to 400000,
• the thermosetting resin consists of an epoxy resin,
• the temporary fixing material layer further comprises an epoxy resin curing agent that cures the epoxy resin, the epoxy resin curing agent consisting of a phenol resin,
• the combined content of the thermoplastic resin, the thermosetting resin, the curing accelerator, the filler and the epoxy resin curing agent is 90% by mass or more based on the total amount of the temporary fixing material layer,
• the content of the thermosetting resin in the temporary fixing material layer is 10 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
• the curing accelerator consists of an imidazole,
• the content of the curing accelerator in the temporary fixing material layer is 0.01 to 5.0 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermosetting resin, and
• wherein the temporary fixing material layer has a shear viscosity at 60° C. of 100 to 10000 Pa·s, an elastic modulus of 10 to 1000 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 1 hour at 170° C., and a 5% weight reduction temperature of 300° C. or higher after being heated for 30 minutes at 130° C. and for 1 hour at 170° C.

A method for producing an electronic device, the method comprising:

• forming a laminated body including a temporary fixing material located between a support and an organic substrate having a thickness of 1000 μm or less;
• heating the temporary fixing material of the laminated body;
• mounting a semiconductor chip on the organic substrate of the laminated body after heating the temporary fixing material;
• sealing the semiconductor chip mounted on the organic substrate with a sealing material;
• and
• peeling the support and the temporary fixing material from the organic substrate of the laminated body after sealing the semiconductor chip,
• wherein the temporary fixing material comprises a thermoplastic resin, a thermosetting resin, and a curing accelerator, and either contains no silicone-based release agent or has a content of a silicone-based release agent of 10% by mass or less based on a total amount of the temporary fixing material,
• the thermoplastic resin consists of a (meth)acrylic copolymer having a crosslinkable epoxy group, a Tg of −50° C. to 50° C., and a weight average molecular weight of 100000 to 400000,
• the thermosetting resin consists of an epoxy resin,
• the temporary fixing material further comprises an epoxy resin curing agent that cures the epoxy resin, the epoxy resin curing agent consisting of a phenol resin,
• the combined content of the thermoplastic resin, the thermosetting resin, the curing accelerator, and the epoxy resin curing agent is 90% by mass or more based on the total amount of the temporary fixing material,
• the content of the thermosetting resin in the temporary fixing material is 10 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
• the curing accelerator consists of an imidazole,
• the content of the curing accelerator in the temporary fixing material is 0.01 to 5.0 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermosetting resin, and
• wherein the temporary fixing material has a shear viscosity of 100 to 10000 Pa·s at 60° C., an elastic modulus of 10 to 1000 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 1 hour at 170° C., and a 5% weight reduction temperature of 300° C. or higher after being heated for 30 minutes at 130° C. and for 1 hour at 170° C.