H10W 72/60
Strap connectors
Official title: Strap connectors, e.g. thick copper clips for grounding of power devices
H10W72/60 (Strap connectors) appears on 2,647 US grants and 3,172 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,647
- Published applications
- 3,172
- Assignees
- 563
- Inventors
- 4,127
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 10 | 0 |
| 1989 | 9 | 0 |
| 1990 | 6 | 0 |
| 1991 | 13 | 0 |
| 1992 | 11 | 0 |
| 1993 | 6 | 0 |
| 1994 | 13 | 0 |
| 1995 | 15 | 0 |
| 1996 | 10 | 0 |
| 1997 | 14 | 0 |
| 1998 | 16 | 0 |
| 1999 | 12 | 0 |
| 2000 | 15 | 0 |
| 2001 | 30 | 22 |
| 2002 | 41 | 57 |
| 2003 | 48 | 53 |
| 2004 | 39 | 83 |
| 2005 | 47 | 76 |
| 2006 | 63 | 106 |
| 2007 | 53 | 131 |
| 2008 | 49 | 95 |
| 2009 | 64 | 112 |
| 2010 | 98 | 104 |
| 2011 | 92 | 109 |
| 2012 | 105 | 129 |
| 2013 | 123 | 129 |
| 2014 | 117 | 146 |
| 2015 | 158 | 172 |
| 2016 | 147 | 144 |
| 2017 | 142 | 146 |
| 2018 | 119 | 132 |
| 2019 | 128 | 131 |
| 2020 | 105 | 147 |
| 2021 | 139 | 183 |
| 2022 | 118 | 152 |
| 2023 | 111 | 176 |
| 2024 | 117 | 198 |
| 2025 | 116 | 144 |
| 2026 | 87 | 95 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor device29 Sep 2026US 12,751,295 B2Rohm Co., Ltd.
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Diode layer stack flip-chip mounted to a leadframe by use of a copper nickel tin metallization stack and diffusion soldering15 Sep 2026US 12,740,438 B2Infineon Technologies Austria AG
- Semiconductor device and method for manufacturing semiconductor device15 Sep 2026US 12,740,458 B2Mitsubishi Electric Corporation
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor device and vehicle8 Oct 2026US 2026/0314464 A1Fuji Electric Co., Ltd.
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
- Clips for semiconductor package and related methods24 Sep 2026US 2026/0293708 A1Semiconductor Components Industries, LLC
- Packaged electronic device comprising a horizontal contact configuration component and a vertical contact configuration component24 Sep 2026US 2026/0293742 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Through silicon via, folded flex microelectronic package562US 6,924,551 B2Intel Corporation · 2005
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002