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US 6,924,551 B2Granted
Through silicon via, folded flex microelectronic package
AssigneeIntel Corporation
InventorsChristopher L. Rumer, Edward A. Zarbock
Life of this patent
Estimating the term…
Abstract
A microelectronic package including a microelectronic die having through silicon vias extending through a back surface thereof, which allows both an active surface and the back surface of the microelectronic die to have power, ground, and/or input/output signals connected to a flexible substrate. The flexible substrate may further connected to an external substrate through at least one external contact.
Claims23
A microelectronic package, comprising:
- a microelectronic die having an active surface and a back surface, said microelectronic die having an integrated circuit layer proximate said microelectronic die active surface and at least one conductive via extending from said microelectronic die back surface to said microelectronic integrated circuit layer;
- and
- a flexible substrate having a first surface and a second surface, wherein said microelectronic die active surface substantially faces a first portion of said flexible substrate first surface and is electrically connected to said flexible substrate first surface and wherein said microelectronic die back surface substantially faces a second portion of said flexible substrate first surface and at least one conductive via is electrically connected to said flexible substrate first surface.
A microelectronic package, comprising:
- a microelectronic die having an active surface and a back surface, said microelectronic die having an integrated circuit layer proximate said microelectronic die active surface and at least one conductive via extending from said microelectronic die back surface to said microelectronic integrated circuit layer;
- a flexible substrate having a first surface and a second surface, wherein said microelectronic die active surface substantially faces a first portion of said flexible substrate first surface and is electrically connected to said flexible substrate first surface and wherein said microelectronic die back surface substantially faces a second portion of said flexible substrate first surface and at least one conductive via is electrically connected to said flexible substrate first surface;
- and
- a plurality of external contacts extending between a substrate and said flexible substrate second surface.
1 more element
A method of fabricating a microelectronic package, comprising:
- providing a microelectronic die having an active surface and a back surface, said microelectronic die having an integrated circuit layer proximate said microelectronic die active surface and at least one conductive via extending from said microelectronic die back surface to said microelectronic integrated circuit layer;
- and
- providing a flexible substrate having a first surface and a second surface;
- orienting a first portion of said flexible substrate first surface to substantially face said microelectronic die active surface;
- electrically connecting said microelectronic die active surface to said flexible substrate first surface;
- orienting a second portion of said flexible substrate first surface to substantially face said microelectronic die back surface;
- and
- electrically connecting said at least one conductive via to said flexible substrate first surface.
5 more elements
A microelectronic system, comprising:
- a substrate within a housing;
- and
- at least one microelectronic package attached to said substrate, including:
- a microelectronic die having an active surface and a back surface, said microelectronic die having an integrated circuit layer proximate said microelectronic die active surface and at least one conductive via extending from said microelectronic die back surface to said microelectronic integrated circuit layer;
- and
- a flexible substrate having a first surface and a second surface, wherein said microelectronic die active surface substantially faces a first portion of said flexible substrate first surface and is electrically connected to said flexible substrate first surface and wherein said microelectronic die back surface substantially faces a second portion of said flexible substrate first surface and at least one conductive via is electrically connected to said flexible substrate first surface.
3 more elements
Dependencies are inferred from the claim text.