H10W 72/681
Auxiliary members
Official title: {Auxiliary members, e.g. flow barriers}
H10W72/681 (Auxiliary members) appears on 54 US grants and 69 published applications in this corpus.
Search patents in H10W- Granted patents
- 54
- Published applications
- 69
- Assignees
- 28
- Inventors
- 132
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 2 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 2 |
| 2016 | 2 | 3 |
| 2017 | 3 | 4 |
| 2018 | 4 | 4 |
| 2019 | 4 | 6 |
| 2020 | 2 | 14 |
| 2021 | 11 | 10 |
| 2022 | 7 | 3 |
| 2023 | 7 | 4 |
| 2024 | 4 | 7 |
| 2025 | 3 | 4 |
| 2026 | 1 | 4 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor17 Mar 2026US 12,581,983 B2Danfoss Silicon Power GmbH
- Semiconductor package and related methods1 Jul 2025US 12,347,813 B2Semiconductor Components Industries, LLC
- Packaged power electronic device, in particular bridge circuit comprising power transistors, and assembling process thereof6 May 2025US 12,295,128 B2STMicroelectronics S,r.l.
- Clip design and method of controlling clip position22 Apr 2025US 12,283,562 B2Semiconductor Components Industries, LLC
- Package including multiple semiconductor devices12 Nov 2024US 12,142,551 B2Semiconductor Components Industries, LLC
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Semiconductor package and method of manufacturing the same18 Jun 2026US 2026/0173965 A1Samsung Electronics Co., Ltd.
- Semiconductor Package16 Apr 2026US 2026/0107787 A1Nexperia B. V.
- Semiconductor device9 Apr 2026US 2026/0101772 A1Kabushiki Kaisha Toshiba
- Semiconductor package and related methods18 Sep 2025US 2025/0293213 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Semiconductor device, manufacturing method thereof and aggregate type semiconductor device181US 6,208,021 B1Oki Electric Industry Co., Ltd. · 2001
- Semiconductor device, manufacturing method thereof and aggregate type semiconductor device19US 6,403,398 B2Oki Electric Industry Co., Ltd. · 2002
- Manufacturing method for power semiconductor device, and power semiconductor device7US 10,096,570 B2Mitsubishi Electric Corporation · 2018
- Semiconductor package and related methods4US 11,830,856 B2Semiconductor Components Industries, LLC · 2023
- Semiconductor package with solder standoff3US 11,177,197 B2Texas Instruments Incorporated · 2021