Clip design and method of controlling clip position
AssigneeSemiconductor Components Industries, LLC
InventorsAtapol Prajuckamol, Chee Hiong Chew, Vemmond Jeng Hung Ng
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Abstract
According to an aspect, a power electronic module includes a substrate, a semiconductor die coupled to the substrate, and a clip member configured to secure the semiconductor die to the substrate, where the clip member includes a base portion having a surface coupled to the semiconductor die, an extender portion that extends from the base portion, where the extender portion includes a contact portion coupled to the substrate, and at least one protrusion that extends from the base portion or the extender portion.
Claims20
A power electronic module comprising:
- a substrate;
- a semiconductor die coupled to the substrate;
- and
- a clip member configured to secure the semiconductor die to the substrate, the clip member including:
- a base portion having a first surface coupled to a surface of the semiconductor die, the base portion having a sidewall that extends between the first surface and a second surface of the base portion;
- an extender portion that extends from the base portion, the extender portion including a contact portion coupled to the substrate;
- and
- a protrusion that extends from the sidewall of the base portion in a direction away from the surface of the semiconductor die, the protrusion configured to align with a guide member.
A power electronic module comprising:
- a substrate;
- a semiconductor die coupled to the substrate via a first adhesive portion;
- a guide member having a hole;
- and
- a clip member configured to secure the semiconductor die to the substrate, the clip member including:
- a base portion having a first surface coupled to a surface of the semiconductor die via a second adhesive portion, the base portion having a sidewall that extends between the first surface and a second surface of the base portion;
- an extender portion that extends from the base portion, the extender portion including a contact portion coupled to the substrate via a third adhesive portion;
- and
- a protrusion that extends from the sidewall of the base portion, the protrusion extending into the hole of the guide member.
A power electronic module comprising:
- a substrate defining a first slot and a second slot;
- a semiconductor die coupled to the substrate via a first adhesive portion;
- and
- a clip member configured to assist with securing the semiconductor die to the substrate, the clip member including:
- a base portion having a surface coupled to the semiconductor die via a second adhesive portion;
- an extender portion that extends from the base portion, the extender portion including a contact portion coupled to the substrate via a third adhesive portion, the third adhesive portion being located between the first slot and the second slot;
- and
- a first protrusion that extends from a first sidewall of the contact portion;
- and
- a second protrusion that extends from a second sidewall of the contact portion, at least a portion of the first protrusion being disposed in the first slot, at least a portion of the second protrusion being disposed in the second slot.
A clip member for a power electronic module, the clip member comprising:
- a base portion having a first surface configured to be coupled to a surface of a semiconductor die, the base portion having a sidewall that extends between the first surface and a second surface of the base portion, the base portion having a second sidewall that extends between the first surface of the base portion and the second surface of the base portion;
- an extender portion that extends from the base portion, the extender portion including a contact portion configured to be coupled to a substrate;
- a first protrusion that extends from the first sidewall;
- and
- a second protrusion that extends from the second sidewall.
Dependencies are inferred from the claim text.