H10W 72/685
Alignment aids
Official title: {Alignment aids, e.g. alignment marks}
H10W72/685 (Alignment aids) appears on 20 US grants and 24 published applications in this corpus.
Search patents in H10W- Granted patents
- 20
- Published applications
- 24
- Assignees
- 12
- Inventors
- 51
- Latest grant
- 1 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 2 |
| 2016 | 2 | 1 |
| 2017 | 1 | 1 |
| 2018 | 2 | 1 |
| 2019 | 1 | 3 |
| 2020 | 1 | 4 |
| 2021 | 5 | 2 |
| 2022 | 0 | 1 |
| 2023 | 2 | 1 |
| 2024 | 2 | 3 |
| 2025 | 1 | 2 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and related methods1 Jul 2025US 12,347,813 B2Semiconductor Components Industries, LLC
- Package including multiple semiconductor devices12 Nov 2024US 12,142,551 B2Semiconductor Components Industries, LLC
- Semiconductor package with solder standoff20 Feb 2024US 11,908,780 B2Texas Instruments Incorporated
- Semiconductor package and related methods28 Nov 2023US 11,830,856 B2Semiconductor Components Industries, LLC
- Package including multiple semiconductor devices3 Jan 2023US 11,545,421 B2Semiconductor Components Industries, LLC
- Semiconductor Package16 Apr 2026US 2026/0107787 A1Nexperia B. V.
- Semiconductor package and related methods18 Sep 2025US 2025/0293213 A1Semiconductor Components Industries, LLC
- Package including multiple semiconductor devices1 May 2025US 2025/0140659 A1Semiconductor Components Industries, LLC
- Clips with alignment features and related methods3 Oct 2024US 2024/0332145 A1Semiconductor Components Industries, LLC
- Semiconductor package and related methods29 Feb 2024US 2024/0072009 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Semiconductor device, manufacturing method thereof and aggregate type semiconductor device181US 6,208,021 B1Oki Electric Industry Co., Ltd. · 2001
- Semiconductor device, manufacturing method thereof and aggregate type semiconductor device19US 6,403,398 B2Oki Electric Industry Co., Ltd. · 2002
- Semiconductor package and related methods4US 11,830,856 B2Semiconductor Components Industries, LLC · 2023
- Semiconductor package with solder standoff3US 11,177,197 B2Texas Instruments Incorporated · 2021
- Semiconductor device and manufacturing method thereof2US 9,530,723 B2Renesas Electronics Corporation · 2016