Clips with alignment features and related methods

A clip for a semiconductor package, the clip comprising:

• at least a first alignment portion coupled with a main portion, the at least first alignment portion extending away from the main portion;
• and
• at least a second alignment portion coupled with the main portion, the at least second alignment portion extending away from the main portion;
• wherein the at least first alignment portion is configured to engage with a first alignment slot of a leadframe and the at least second alignment portion is configured to engage with a second alignment slot of the leadframe to align the main portion in a desired orientation relative to the leadframe.

A method of assembling a semiconductor package, the method comprising:

• providing a clip comprising one of:
• at least a first alignment portion and at least second alignment portion coupled with a main portion, the at least first alignment portion and the at least second alignment portion extending away from the main portion;
• at least a first thinned portion and at least a second thinned portion coupled with the main portion, the at least first thinned portion extending in a first direction away from the main portion and the at least second thinned portion extending in a second direction away from the main portion;
• or
• any combination thereof;
• attaching a semiconductor die to a leadframe;
• engaging one of:
• the at least first alignment portion and the at least second alignment portion with a first alignment slot and with a second alignment slot of the leadframe respectively;
• the at least first thinned portion and the at least second thinned portion with a first thinned portion of a leadframe and with a second thinned portion of the leadframe, respectively;
• or
• any combination thereof;
• molding a mold compound over the semiconductor die, at least a portion of the leadframe, and at least a portion of the clip;
• and
• trimming the leadframe and the clip to form a plurality of leads.