Back to results
US 9,530,723 B2Granted
Semiconductor device and manufacturing method thereof
AssigneeRenesas Electronics Corporation
InventorsAkira Muto, Koji Bando, Yukihiro Sato, Kazuhiro Mitamura
Life of this patent
Estimating the term…
Abstract
On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.
Claims15
A manufacturing method of a semiconductor device, comprising:
- (a) a step of preparing a chip mounting part;
- (b) a step of preparing a lead frame including a lead and a hanging part;
- (c) a step of preparing a metal plate including a main body part and an extension part;
- (d) a step of mounting a semiconductor chip on an upper surface of the chip mounting part via a first conductive adhesive;
- (e) after the step (d), a step of arranging the lead frame above the chip mounting part on which the semiconductor chip is mounted;
- (f) after the step (e), a step of arranging the main body part of the metal plate via a second conductive adhesive so as to overlap an electrode pad of the semiconductor chip and a part of the lead when seen in a plan view and arranging the extension part of the metal plate on the hanging part of the lead frame;
- and
- (g) after the step (f), a step of forming a sealing member by sealing the semiconductor chip.
5 more elements
Dependencies are inferred from the claim text.