US 2026/0107787 A1Published application

Semiconductor Package

AssigneeNexperia B.V.

InventorsMohd Rozaini Mohd Zali, Brian Aranas, Kow Siew Ting, Wing Onn Chaw

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Abstract

A semiconductor package, a method of manufacturing thereof, and a lead frame are provided, the package includes the lead frame and a die pad and a bond clip. The lead frame exhibits a longitudinal and a transverse dimension perpendicular to the longitudinal dimension. The package includes a die having a first die side mounted to the die pad mounting portion and a second die side opposite to the first, and a bond clip exhibiting a first and second longitudinal dimension perpendicular to the first longitudinal dimension. The bond clip has a first clip mounted to the bond clip of the lead frame using solder and a second clip mounted to the second die side of the die, the bond clip of the lead frame has features to prevent displacement of the bond clip in both the longitudinal and transverse dimension, and to confine the solder on the bond clip.

Claims18

Dependent claims

A semiconductor package comprising:

a lead frame comprising a die pad mounting portion and a bond clip mounting portion, the lead frame exhibiting a longitudinal dimension and a transverse dimension oriented perpendicular to the longitudinal dimension;
a semiconductor die having a first die side mounted to the die pad mounting portion and a second die side opposite to the first side;
a bond clip exhibiting a first longitudinal dimension and a second longitudinal dimension oriented perpendicular to the first longitudinal dimension, the bond clip having a first clip portion mounted to the bond clip mounting portion of the lead frame using solder and a second clip portion mounted to the second die side of the semiconductor die, wherein the bond clip mounting portion of the lead frame is provided with alignment features structured to prevent displacement of the bond clip in a direction of the longitudinal and/or the transverse dimension of the lead frame, and to confine the solder on the bond clip mounting portion.

Dependencies are inferred from the claim text.