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US 12,142,551 B2Granted
Package including multiple semiconductor devices
AssigneeSemiconductor Components Industries, LLC
InventorsJerome Teysseyre, Maria Cristina Estacio, Seungwon Im
Life of this patent
Estimating the term…
Abstract
In a general aspect, an apparatus can include an inner package including a first silicon carbide die having a die gate conductor coupled to a common gate conductor, and a second silicon carbide die having a die gate conductor coupled to the common gate conductor. The apparatus can include an outer package including a substrate coupled to the common gate conductor, and a clip coupled to the inner package and coupled to the substrate.
Claims20
An apparatus, comprising:
- a package including:
- a common gate conductor,
- a first semiconductor die having a die gate conductor, and
- a second semiconductor die having a die gate conductor;
- a first conductive path, including a first wirebond, between the common gate conductor and the die gate conductor of the first semiconductor die;
- and
- a second conductive path, including a second wirebond, between the common gate conductor and the die gate conductor of the second semiconductor die.
4 more elements
An apparatus, comprising:
- a first package including a gate metal runner;
- a second package disposed in the first package and including:
- a first silicon carbide die having a gate conductor, and
- a second silicon carbide die having a gate conductor;
- a first conductive path, including a first wirebond, between the gate metal runner and the gate conductor of the first silicon carbide die;
- and
- a second conductive path, including a second wirebond, between the gate metal runner and the gate conductor of the second silicon carbide die.
4 more elements
Dependencies are inferred from the claim text.