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US 2025/0140659 A1Published application
Package including multiple semiconductor devices
AssigneeSemiconductor Components Industries, LLC
InventorsJerome TEYSSEYRE, Maria Cristina ESTACIO, Seungwon IM
Life of this patent
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Abstract
In a general aspect, an apparatus can include an inner package including a first silicon carbide die having a die gate conductor coupled to a common gate conductor, and a second silicon carbide die having a die gate conductor coupled to the common gate conductor. The apparatus can include an outer package including a substrate coupled to the common gate conductor, and a clip coupled to the inner package and coupled to the substrate.
Claims24
(canceled)
(canceled)
An apparatus, comprising:
- a common gate conductor having:
- a first portion, and
- a second portion;
- a first semiconductor die and a second semiconductor die coupled to the first portion of the common gate conductor;
- and
- a third semiconductor die coupled to the second portion of the common gate conductor.
3 more elements
An apparatus, comprising:
- a common gate conductor having:
- a first portion, and
- a second portion;
- a first semiconductor die and a second semiconductor die coupled to opposite sides of the first portion of the common gate conductor;
- and
- a third semiconductor die coupled to the second portion of the common gate conductor.
3 more elements
An apparatus, comprising:
- a common gate conductor having:
- a first portion,
- a second portion, and
- a third portion orthogonal to the first portion and the second portion;
- and
- a first semiconductor die and a second semiconductor die coupled to opposite portions of the first portion of the common gate conductor.
3 more elements
Dependencies are inferred from the claim text.