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US 11,830,856 B2Granted
Semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsChee Hiong Chew, Erik Nino Tolentino, Vemmond Jeng Hung Ng, Shutesh Krishnan
Life of this patent
Estimating the term…
Abstract
Implementations of semiconductor packages may include one or more die coupled over a substrate, an electrically conductive spacer coupled over the substrate, and a clip coupled over and to the one or more die and the electrically conductive spacer. The clip may electrically couple the one or more die and the electrically conductive spacer.
Claims19
A semiconductor package comprising:
- a first die coupled over a substrate;
- a second die coupled over the substrate;
- an electrically conductive spacer coupled over the substrate;
- and
- a clip coupled over and directly to the first die, the second die, and the electrically conductive spacer through one of a conductive adhesive or a solder;
- wherein the clip electrically couples the first die and the second die with the electrically conductive spacer;
- wherein the clip comprises a first portion with a first thickness and a second portion with a second thickness less than the first thickness;
- and
- wherein the first portion is directly coupled over the first die and the second portion is directly coupled over the second die and the electrically conductive spacer.
6 more elements
A semiconductor package comprising:
- one or more die coupled over a substrate;
- an electrically conductive spacer coupled over the substrate;
- and
- a redistribution layer (RDL) comprising boron nitrite coupled over and directly to the one or more die and the electrically conductive spacer through one of a conductive adhesive or a solder;
- wherein the RDL electrically connects the one or more die and the electrically conductive spacer;
- and
- wherein a height of the electrically conductive spacer is the same as a height of a die of the one or more die.
4 more elements
A semiconductor package comprising:
- a plurality of semiconductor modules, each module comprising:
- a first die coupled over a substrate;
- a second die coupled over a substrate;
- an electrically conductive spacer coupled over the substrate;
- and
- a clip coupled over and directly to the first die, the second die, and the electrically conductive spacer through one of a conductive adhesive or a solder;
- wherein the clip electrically couples the first die and the second die with and the electrically conductive spacer;
- wherein the clip comprises a first portion with a first thickness and a second portion with a second thickness less than the first thickness;
- and
- wherein a thickness of the first die is greater than a thickness of the second die and the thickness of the second die is the same as a thickness of the electrically conductive spacer.
7 more elements
Dependencies are inferred from the claim text.