Semiconductor package with solder standoff

A multichip module (MCM) power package, comprising:

• a leadframe including a die pad and a plurality of lead terminals;
• stacked power field effect transistors (FETs), comprising:
• a first FET die attached to the die pad;
• a first clip on the first FET die that is connected to a terminal of the first FET die providing a first bonded interface, wherein the first clip is connected to at least a first of the plurality of lead terminals;
• a second FET die over the first clip having a terminal connected to the first clip providing a second bonded interface;
• a second clip on the second FET die that is connected to terminal of the second FET die to provide a third bonded interface, where the second clip is connected to at least a second of the plurality of lead terminals, and
• wherein at least one of the first, the second, and the third bonded interfaces include a non-metallic protruding surface standoff therein that extends from a surface of the first or the second FET die to contact the first clip, or the second clip.