Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorsShinji Ohuchi, Yasushi Shiraishi, Hiroshi Kawano, Etsuo Yamada
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Abstract
A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.
Claims20
A semiconductor device, comprising:
- a substrate having a semiconductor circuit surface with a semiconductor circuit formed thereon, the semiconductor circuit surface including a first surface portion composed of a central portion of the semiconductor circuit surface, and a second surface portion that surrounds the first surface portion;
- a single undivided insulating layer, including an insulating adhesive tape, on the first surface portion, the second surface portion being free of the insulating layer;
- a plurality of leads disposed both directly on the insulating layer and over the second surface portion, the leads being electrically independent of each other;
- a plurality of metal bumps, each of the leads corresponding to a respective one of the metal bumps, each of the metal bumps being disposed between the corresponding lead and the second surface portion;
- and
- a resin mold covering the insulating layer and the substrate, wherein surfaces of the leads are free of the mold resin and exposed for external connection.
An aggregate-type semiconductor device, comprising a plurality of individual semiconductor devices, each semiconductor device having a first surface, a second surface opposite to the first surface, and a side surface extending between the first and second surfaces, each of said individual semiconductor devices including:
- a resin mold at the first surface, and
- a plurality of leads, each lead being connected to the first surface, each lead having outer surfaces that are free of the resin mold and are exposed for external connection, each lead extending from the first surface to the side surface and extending along the side surface toward the second surface, each lead having a front edge terminating on the side surface,
- wherein each lead of each one of the individual semiconductor devices is connected to a corresponding lead of another one of the individual semiconductor devices.
A semiconductor device comprising:
- a substrate having a semiconductor circuit surface with a semiconductor circuit formed thereon;
- an insulating layer, including an insulating adhesive tape, on the semiconductor circuit forming surface;
- a plurality of leads disposed on the insulating layer at regular intervals and being electrically independent of each other, each lead having an inner surface that faces the semiconductor circuit surface, an outer surface opposite to the inner surface, and a side surface extending between the outer and inner surfaces, wherein at least the outer surface is coated with conductive metal plating and the side surface is free of metal plating;
- a plurality of metal bumps, each of the leads corresponding to a respective one of the metal bumps, each of the bumps being disposed between the inner surface of the corresponding lead and the semiconductor circuit surface;
- and
- a resin mold covering the side surfaces of the leads and surfaces of the insulating layer and the substrate, wherein the outer surfaces of the leads are free of the resin mold.
Dependencies are inferred from the claim text.