Semiconductor package and method of manufacturing the same

A semiconductor package comprising:

• a package substrate;
• first and second semiconductor chips stacked on the package substrate in a stepped structure, wherein the first semiconductor chip of the first and second semiconductor chips has a first side surface and the second semiconductor chip of the first and second semiconductor chips has a second side surface;
• a first side insulation layer disposed on the first and second side surfaces of the first and second semiconductor chips, the first side insulation layer having a first slope surface;
• a sealant sealing the first and second semiconductor chips, on the package substrate;
• and
• a first conductive connection pattern electrically connecting the first and second semiconductor chips to the package substrate,
• wherein:
• the first conductive connection pattern is in contact with the first slope surface of the first side insulation layer, the first conductive connection pattern is disposed on a portion of each of upper surfaces of the first and second semiconductor chips, and the first conductive connection pattern is disposed on a portion of an upper surface of the package substrate,
• the first side insulation layer has first and second insulation patterns,
• the first insulation pattern is in contact with the first side surface of the first semiconductor chip configured to have a first triangular pillar shape,
• in a cross sectional view, the first triangular pillar shape has a first right-angled triangular shape,
• the second insulation pattern is in contact with the second side surface of the second semiconductor chip configured to have a second triangular pillar shape,
• in a cross sectional view, the second triangular pillar shape has a second right-angled triangular shape,
• in the cross sectional view, each of the first and second right-angled triangular shapes have two adjacent line segments and a hypotenuse segment extending between the two adjacent line segments, the two adjacent line segments are perpendicular to each other, and the hypotenuse segment is at an acute angle to the upper surface of the package substrate,
• the first and second semiconductor chips and the first and second insulation patterns are arranged such than each of the first and second side surfaces is configured to be in contact with one of a corresponding two of the adjacent line segments,
• the first slope surface of the first side insulation layer includes first and second sub-surfaces each of which is configured to corresponds to one of the hypotenuse segments of the first and second right-angled triangular shapes,
• the first conductive connection pattern comprises a first portion and a second portion, the first portion has a linear shape and is in contact with the first slope surface of the first side insulation layer, and the first and second portions are directly electrically connected to each other in series,
• the second portion has a bent shape, and
• the second portion is in contact with:
• the first sub-surface of the first slope surface of the first side insulation layer and the first semiconductor chip, or
• the second sub-surface of the first slope surface of the first side insulation layer and the package substrate.

A semiconductor package comprising:

• a package substrate;
• first and second semiconductor chips stacked on the package substrate, in a stepped configuration;
• a side insulation layer disposed on a side surface of each of the first and second semiconductor chips;
• and
• a conductive connection pattern in contact with the side insulation layer and connecting the first and second semiconductor chips to the package substrate,
• wherein:
• the conductive connection pattern comprises a first conductive material portion and a second conductive material portion,
• the first conductive material portion has greater electrical conductivity than the second conductive material portion, and
• the second conductive material portion has greater flexibility than the first conductive material portion.