H10W 72/621
Structures or relative sizes of strap connectors
Official title: {Structures or relative sizes of strap connectors}
H10W72/621 (Structures or relative sizes of strap connectors) appears on 350 US grants and 441 published applications in this corpus.
Search patents in H10W- Granted patents
- 350
- Published applications
- 441
- Assignees
- 125
- Inventors
- 744
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 2 |
| 2002 | 2 | 5 |
| 2003 | 4 | 2 |
| 2004 | 3 | 3 |
| 2005 | 3 | 7 |
| 2006 | 4 | 7 |
| 2007 | 3 | 17 |
| 2008 | 3 | 12 |
| 2009 | 5 | 14 |
| 2010 | 16 | 17 |
| 2011 | 11 | 14 |
| 2012 | 16 | 23 |
| 2013 | 16 | 20 |
| 2014 | 18 | 23 |
| 2015 | 30 | 39 |
| 2016 | 34 | 20 |
| 2017 | 19 | 17 |
| 2018 | 11 | 14 |
| 2019 | 20 | 15 |
| 2020 | 11 | 27 |
| 2021 | 23 | 23 |
| 2022 | 14 | 27 |
| 2023 | 23 | 18 |
| 2024 | 13 | 24 |
| 2025 | 21 | 25 |
| 2026 | 11 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Semiconductor device8 Sep 2026US 12,733,496 B2Power Master Semiconductor Co., Ltd.
- Isolated metal clips with structural bridge14 Jul 2026US 12,685,193 B2Analog Devices, Inc.
- Semiconductor package with a cured electrically conductive paste interconnect and method for producing the same14 Jul 2026US 12,685,209 B2Nexperia B. V.
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor device and method of manufacturing semiconductor device17 Sep 2026US 2026/0282921 A1Kabushiki Kaisha Toshiba
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
- Thermally conductive structure for heat dissipation at an integrated circuit die27 Aug 2026US 2026/0255956 A1STMicroelectronics International N. V.
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
Most cited
By later US patents
- Wireless radio frequency power semiconductor devices using high density interconnect171US 5,637,922 AGeneral Electric Company · 1997
- Low thermal resistance, low stress semiconductor package41US 4,278,990 AGeneral Electric Company · 1981
- Methods of packaging a semiconductor die and package formed by the methods36US 8,183,682 B2NXP B. V. · 2012
- Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells34US 8,636,198 B1SunPower Corporation · 2014
- Semiconductor device with uneven metal plate to improve adhesion to molding compound31US 6,849,930 B2NEC Corporation · 2005