Isolated metal clips with structural bridge
AssigneeAnalog Devices, Inc.
InventorsHien Minh Pham, Melvin Sto Domingo Nava, John David Brazzle
Life of this patent
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AssigneeAnalog Devices, Inc.
InventorsHien Minh Pham, Melvin Sto Domingo Nava, John David Brazzle
Estimating the term…
Methods, and systems, are presented for a Structural Bridge for Electrically Isolated Metal Clips by mounting on a substrate a first and a second circuit. These first and second circuits can include Component on Package (CoP) electronic parts that are electrically contacted to the substrate with metal clips mounted on the surface of the substrate. The metal clips are electrically connected to respective circuit first and second circuits by an electrical connection on or in the substrate. The metal clips are folded over the respective first and second circuits. The folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other. A third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip.
An apparatus comprising:
An apparatus comprising:
An apparatus comprising:
Dependencies are inferred from the claim text.