H10W 72/624
Strap connectors having multiple distinct cores
Official title: {Strap connectors having multiple distinct cores}
H10W72/624 (Strap connectors having multiple distinct cores) appears on 10 US grants and 10 published applications in this corpus.
Search patents in H10W- Granted patents
- 10
- Published applications
- 10
- Assignees
- 10
- Inventors
- 24
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 2 | 1 |
| 2018 | 0 | 1 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Power substrate assembly with reduced warpage20 May 2025US 12,308,338 B2Littelfuse, Inc.
- Semiconductor device28 Jul 2020US 10,727,163 B2Mitsubishi Electric Corporation
- Semiconductor module having a conductor member for reducing thermal stress26 Dec 2017US 9,853,009 B2Mitsubishi Electric Corporation
- Semiconductor device having multiple contact clips5 Dec 2017US 9,837,380 B2Infineon Technologies Austria AG
- Power substrate assembly with reduced warpage18 Jan 2024US 2024/0021568 A1Littelfuse, Inc.
- Power semiconductor module15 Jun 2023US 2023/0187404 A1Wuxi Leapers Semiconductor Co., Ltd.
- Semiconductor Device20 Jun 2019US 2019/0189537 A1Mitsubishi Electric Corporation
- Chip arrangement and method for forming a contact connection15 Feb 2018US 2018/0047697 A1Pac Tech—Packaging Technologies GmbH
- Semiconductor module23 Mar 2017US 2017/0084568 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Low thermal resistance, low stress semiconductor package41US 4,278,990 AGeneral Electric Company · 1981
- Semiconductor package having strengthening and sealing upper chamber19US 4,249,034 AGeneral Electric Company · 1981
- Method of mounting a circuit component and joint structure therefor7US 6,822,331 B2Delphi Technologies, Inc. · 2004
- Semiconductor device having multiple contact clips5US 9,837,380 B2Infineon Technologies Austria AG · 2017
- Stud-type semiconductor device2US 4,143,395 ATokyo Shibaura Electric Co., Ltd. · 1979