Semiconductor module having a conductor member for reducing thermal stress
AssigneeMitsubishi Electric Corporation
InventorsMasakazu Tani, Yoshiyuki Deguchi
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Abstract
In the semiconductor module according to the present invention, a conducting member which is used to electrically connect a semiconductor element arranged on a substrate or a bus bar with another electronic component is provided with a structure having flexibility capable of, in a junction with the semiconductor element, reducing the thermal stress due to difference in a coefficient of linear expansion between the conducting member and the semiconductor element, and absorbing dimensional error in objects to be connected. Therefore, the semiconductor module achieves both increased current capacity of the semiconductor device and improved reliability of the semiconductor module.
Claims8
A semiconductor module comprising a conducting member, wherein the conducting member electrically connects a semiconductor element arranged on a substrate or a bus bar with another electronic component and is provided with a structure having flexibility capable of, in a junction with the semiconductor element, reducing thermal stress due to difference in a coefficient of linear expansion between the conducting member and the semiconductor element, and absorbing dimensional error in objects to be connected,
- wherein the semiconductor module further comprises a cooling surface structural part which is insulated from the semiconductor element and is installed on the substrate or the bus bar;
- and
- wherein the conducting member is electrically connected to the semiconductor element and the other electronic component via the cooling surface structural part.
Dependencies are inferred from the claim text.