Semiconductor Device
AssigneeMitsubishi Electric Corporation
InventorsJunji Fujino, Yuji Imoto, Shohei Ogawa, Mikio Ishihara
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Abstract
A semiconductor device includes a semiconductor element having a front electrode, an electrode plate having an area larger than the front electrode of the semiconductor element in a two-dimensional view and made of aluminum or aluminum alloy, and a metal member having a joint surface joined to the front electrode of the semiconductor element with solder, having an area smaller than the front electrode of the semiconductor element in a two-dimensional view, made of a metal different from the electrode plate, and fastened to the electrode plate to electrically connect the front electrode of the semiconductor element to the electrode plate.
Claims14
A semiconductor device comprising:
- a semiconductor element having a front electrode;
- an electrode plate having an area larger than the front electrode of the semiconductor element in a two-dimensional view and formed of aluminum or aluminum alloy;
- and
- a metal member having a joint surface joined to the front electrode of the semiconductor element with a bonding material, having an area smaller than the front electrode of the semiconductor element in a two-dimensional view, formed of a metal different from the electrode plate, and fastened to the electrode plate to electrically connect the front electrode of the semiconductor element to the electrode plate.
Dependencies are inferred from the claim text.