US 12,308,338 B2 · Power substrate assembly with reduced warpage

Abstract

A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. The clip is attached to the power substrate and has a foot at one end and a recessed area at the other, opposite end. The foot is connected to the power substrate. The trimetal has a base, a trapezoid structure, and a clip portion. The base is soldered to the chip. The trapezoid structure is located above the base. The clip portion is located above the trapezoid structure and includes a projecting area. The recessed area of the clip fits into the projecting area of the trimetal.

Claims11

Dependent claims

A substrate assembly comprising:

a power substrate comprising a first direct copper bonded (DCB) surface coupled to a ceramic tile;
a chip soldered onto the first DCB surface;
a clip attached to the power substrate, the clip comprising:
a foot coupled to the power substrate, wherein the foot is disposed at a first end of the clip;
and
a recessed area disposed at a second end of the clip, the second end being opposite the first end;
and
a trimetal comprising:
a base soldered to the chip;
a trapezoid structure disposed atop the base;
and
a clip portion disposed atop the trapezoid structure, the clip portion further comprising a projecting area;
wherein the recessed area of the clip fits into the projecting area of the trimetal.

10 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/864,881Filed 14 Jul 2022

Published

US 2024/0021568 A118 Jan 2024

Granted

20 May 2025

Term ends

Not estimatedThe source records don’t support an estimate.

Classification17 codes

H10W 70/6875
Shapes or dispositions thereof: being on a metallic substrate, e.g. insulated metal substrates [IMS]
H10W 72/60
Interconnections or connectors in packages: strap connectors, e.g. thick copper clips for grounding of power devices
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 70/658
Shapes or dispositions of interconnections: for devices provided for in groups H10D8/00 - H10D48/00

Power substrate assembly with reduced warpage

Life of this patent

Power substrate assembly with reduced warpage

Life of this patent

Abstract

Claims11