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US 9,837,380 B2Granted
Semiconductor device having multiple contact clips
AssigneeInfineon Technologies Austria AG
InventorsTian San Tan, Theng Chao Long
Life of this patent
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Abstract
A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.
Claims20
A semiconductor device, comprising :
- a device carrier;
- a first semiconductor chip mounted on the device carrier;
- a second semiconductor chip mounted on the device carrier;
- a first contact clip bonded to a first electrode of the first semiconductor chip, wherein the first electrode of the first semiconductor chip is arranged on a main surface of the first semiconductor chip facing away from the device carrier;
- a second contact clip bonded to a first electrode of the second semiconductor chip, wherein the first electrode of the second semiconductor chip is arranged on a main surface of the second semiconductor chip facing away from the device carrier;
- an insulating connector holding the first contact clip and the second contact clip together;
- and
- an encapsulant embedding the first semiconductor chip, the second semiconductor chip, the first contact clip, the second contact clip and the insulating connector, wherein the insulating connector is a pre-fabricated part distinct from the encapsulant and having a first side face, a second side face opposite the first side face and a top surface connecting the first side face and the second side face, wherein at least one of the first side face and the second side face of the insulating connector is connected to one of the first contact clip and the second contact clip by one of the group consisting of a groove and tongue connection, a clamp connection, and a snap fit connection, and wherein the top surface of the insulating connector is covered by the encapsulant.
5 more elements
A multi-clip connection element for use as an electrical connector in a semiconductor device package, comprising, when not being incorporated in the semiconductor device package:
- a first contact clip which is an integrally formed part having a first bonding portion and a
- second bonding portion, the first bonding portion extending in a lateral direction and having a surface configured to be bonded to an electrode of a first semiconductor chip, and the second bonding portion having a thickness in a height direction greater than a thickness of the first bonding portion in the height direction and comprising a side face;
- a second contact clip which is an integrally formed part having a first bonding portion and a second bonding portion, the first bonding portion extending in a lateral direction and having a surface configured to be bonded to an electrode of a second semiconductor chip, and the second bonding portion having a thickness in the height direction greater than a thickness of the first bonding portion in the height direction and comprising a side face;
- and
- an insulating connector holding the first contact clip and the second contact clip together, wherein the side faces of the second bonding portions of the first and second contact clips are facing each other, and wherein the insulating connector is coupled to the side faces of the second bonding portions of the first and second contact clips while leaving surfaces opposite the surfaces of the first bonding portions of the first and second contact clips exposed.
2 more elements
A method of manufacturing a semiconductor device, the method comprising:
- mounting a first semiconductor chip on a device carrier;
- mounting a second semiconductor chip on the device carrier;
- and thereafter
- bonding a multi-clip connection element comprising a first contact clip, a second contact clip and an insulating connector holding the first contact clip and the second contact clip together to the first semiconductor chip, to the second semiconductor chip and to the device carrier,
- wherein the insulating connector comprises a first side face having a first coupling portion coupled to a side face of the first contact clip and a second side face opposite the first side face and having a second coupling portion coupled to a side face of the second contact clip, wherein the insulating connector is coupled to the first and second contact clips before the multi-clip connection element is bonded to the first and second semiconductor chips and to the device carrier.
2 more elements
Dependencies are inferred from the claim text.