Back to results
US 4,249,034 AGranted
Semiconductor package having strengthening and sealing upper chamber
AssigneeGeneral Electric Company
InventorsJulie Y. Fichot, Alfred Roesch
Life of this patent
Estimating the term…
Abstract
A semiconductor device is described wherein a semiconductor pellet is disposed within a hermetically sealed chamber including a thermally conductive base and a substantially rigid housing, said housing including an open upper chamber in which are disposed electrical terminals and which is filled with a sealing and strengthening layer to substantially increase the strength and hermeticity of the package.
Claims15
A hermetically sealed semiconductor package comprising:
- a heatsink member having a semiconductor element mounted thereto;
- an electrically insulative sleeve-shaped housing member mounted on said heat sink member and having a partition therein dividing said housing into upwardly and downwardly facing chambers, said downwardly facing chamber cooperating with said heat sink member to form a first closed chamber;
- electrical terminal means extending through said partition connected to said semiconductor element;
- and
- sealing means within said upwardly facing chamber in sealing relationship with said housing member and said electrical terminal means hermetically sealing said first closed chamber.
2 more elements
Dependencies are inferred from the claim text.