H10W 72/627
Multiple strap connectors having different structures or shapes
Official title: {Multiple strap connectors having different structures or shapes}
H10W72/627 (Multiple strap connectors having different structures or shapes) appears on 186 US grants and 228 published applications in this corpus.
Search patents in H10W- Granted patents
- 186
- Published applications
- 228
- Assignees
- 69
- Inventors
- 350
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 1 | 2 |
| 2005 | 1 | 5 |
| 2006 | 2 | 2 |
| 2007 | 2 | 8 |
| 2008 | 1 | 6 |
| 2009 | 2 | 9 |
| 2010 | 10 | 10 |
| 2011 | 7 | 8 |
| 2012 | 10 | 15 |
| 2013 | 13 | 13 |
| 2014 | 9 | 15 |
| 2015 | 20 | 29 |
| 2016 | 21 | 12 |
| 2017 | 12 | 11 |
| 2018 | 6 | 5 |
| 2019 | 7 | 6 |
| 2020 | 6 | 13 |
| 2021 | 11 | 16 |
| 2022 | 6 | 13 |
| 2023 | 16 | 4 |
| 2024 | 4 | 8 |
| 2025 | 10 | 5 |
| 2026 | 2 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Semiconductor device28 Apr 2026US 12,616,076 B2Fuji Electric Co., Ltd.
- Tip connection portion of terminal member and associated semiconductor device9 Dec 2025US 12,494,415 B2Shindengen Electric Manufacturing Co., Ltd.
- Stacked clip design for GaN half bridge IPM28 Oct 2025US 12,456,707 B2Texas Instruments Incorporated
- Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices16 Sep 2025US 12,418,135 B2Amkor Technology Singapore Holding Pte.Ltd.
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
- Semiconductor package having vertically stacked transistors and method of making the same28 May 2026US 2026/0150709 A1Alpha and Omega Semiconductor International LP
- Semiconductor device and package with kelvin source connection28 May 2026US 2026/0150761 A1Nexperia B. V.
- Semiconductor module7 May 2026US 2026/0130219 A1Denso Corporation
- Semiconductor device7 May 2026US 2026/0130260 A1Denso Corporation
Most cited
By later US patents
- Methods of packaging a semiconductor die and package formed by the methods36US 8,183,682 B2NXP B. V. · 2012
- Semiconductor device and switching element29US 7,030,501 B2Kanto Sanyo Semiconductors Co., Ltd. · 2006
- Power semiconductor package and method for making the same26US 6,465,276 B2Siliconx (Taiwan) Ltd. · 2002
- Monolithic semiconductor switches and method for manufacturing26US 8,193,559 B2Infineon Technologies Austria AG · 2012
- Compact semiconductor package with integrated bypass capacitor and method24US 8,062,932 B2Alpha and Omega Semiconductor Incorporated · 2011