Semiconductor module

A semiconductor module comprising:

• a cooler having one surface;
• a resin housing having a frame body and being disposed on the one surface of the cooler to provide a housing space together with the cooler;
• a substrate disposed in the housing space on the one surface of the cooler, the substrate including an insulating base material and a conductor disposed on a surface of the insulating base material opposite to a surface facing the one surface of the cooler;
• a semiconductor element joined to the conductor;
• a main terminal inserted in the housing and joined to the conductor;
• a sealing body filled in the housing space and sealing the substrate, the semiconductor element and a part of the main terminal;
• a sealing material interposed between the one surface of the cooler and a lower surface of the housing;
• and
• a metal member formed with a fastening hole and integrated into the housing, wherein
• the metal member protrudes from the lower surface of the housing and is in contact with the one surface of the cooler to provide a gap with a predetermined height between the lower surface of the housing and the one surface of the cooler.