Semiconductor device
AssigneeDenso Corporation
InventorsKenji ONODA, Masayoshi NISHIHATA, Takahiro HIRANO
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AssigneeDenso Corporation
InventorsKenji ONODA, Masayoshi NISHIHATA, Takahiro HIRANO
Estimating the term…
A semiconductor device includes a resin housing, a substrate, a plurality of semiconductor elements, and a signal terminal. Each of the semiconductor elements has a first main electrode on a first surface, a second main electrode and a pad on a second surface opposite to the first surface. The first main electrodes are joined to a wiring of the substrate. The signal terminal is inserted in the housing, and electrically connected to the pads. The signal terminal includes a branch terminal. The branch terminal has a single first connection portion projecting from the housing to be connected to an external device, a plurality of second connection portions exposed from the housing and individually connected to the pads having a same function of the semiconductor elements, and a coupling portion disposed within the housing and electrically connecting the first connection portion and the second connection portions.
A semiconductor device comprising:
Dependencies are inferred from the claim text.