US 2026/0150761 A1Published application

Semiconductor device and package with kelvin source connection

AssigneeNexperia B.V.

InventorsWei Gong, Pulong Cao, Hui Liu

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Abstract

A semiconductor device and a semiconductor package including such a semiconductor device are presented. The semiconductor device includes one or more dies, a power source clip, a signal source clip, a signal gate clip and a power drain clip, with each clip electrically connected to each of the dies. A Kelvin source connection is integrated on the signal source clip. At least one of the dies have an angle between a path of a power source current between the power source clip and a die and a path of a signal source current between the signal source clip and the die is equal to or larger than 90°.

Claims18

Dependent claims

A semiconductor device comprising:

one or more dies;
a power source clip electrically connected to each of the dies;
a signal source clip electrically connected to each of the dies;
a signal gate clip electrically connected to each of the dies;
and
a power drain clip electrically connected to each of the dies;
and
a Kelvin source connection is integrated on the signal source clip,
wherein, at least one of the dies have an angle (α) between a path of a power source current between the power source clip and the at least one of the dies and a path of a signal source current between the signal source clip and the at least one of the dies is equal to or larger than 90°.

6 more elements

Dependencies are inferred from the claim text.