Semiconductor package with a cured electrically conductive paste interconnect and method for producing the same

A method for producing a semiconductor package, comprising the steps of:

• providing a lead frame and a bond pad with a space therebetween wherein a bottom surface of bond pad comprises an external terminal for mounting to a printed circuit board at a bottom surface of the semiconductor package;
• wherein the lead frame is provided with a die bonded thereon and the die is provided with a die pad;
• wherein the die, the die pad, a part of the lead frame, a part of the bond pad and the space between the lead frame and the bond pad are encapsulated by a first encapsulation, and wherein the encapsulation encapsulates a top surface of the bond pad opposite and directly above the bottom surface of the bond pad comprising the external terminal;
• removing part of the first encapsulation to create a cavity having a bottom surface comprising an exposed surface of the die comprising an exposed surface of the die pad, an exposed surface of the bond pad and a connecting region between the exposed surface of the die pad and the exposed surface of the bond pad;
• partly filling the cavity with an electrically conductive paste to cover the bottom surface of the cavity;
• curing the electrically conductive paste to obtain an interconnect consisting of the cured conductive paste between the die pad and the bond pad;
• and
• encapsulating the interconnect by providing a second encapsulation over the interconnect.