H10W 72/622
Multilayered strap connectors
Official title: {Multilayered strap connectors, e.g. having a coating on a lowermost surface of a core}
H10W72/622 (Multilayered strap connectors) appears on 121 US grants and 148 published applications in this corpus.
Search patents in H10W- Granted patents
- 121
- Published applications
- 148
- Assignees
- 64
- Inventors
- 323
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 3 |
| 2003 | 3 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 1 |
| 2006 | 2 | 4 |
| 2007 | 1 | 9 |
| 2008 | 2 | 6 |
| 2009 | 3 | 5 |
| 2010 | 6 | 9 |
| 2011 | 4 | 7 |
| 2012 | 7 | 8 |
| 2013 | 3 | 7 |
| 2014 | 9 | 7 |
| 2015 | 11 | 9 |
| 2016 | 10 | 7 |
| 2017 | 5 | 5 |
| 2018 | 2 | 4 |
| 2019 | 9 | 6 |
| 2020 | 3 | 9 |
| 2021 | 7 | 5 |
| 2022 | 6 | 9 |
| 2023 | 2 | 4 |
| 2024 | 8 | 5 |
| 2025 | 5 | 8 |
| 2026 | 1 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Semiconductor device26 Aug 2025US 12,400,974 B2Rohm Co., Ltd.
- Connecting strip for discrete and power electronic devices29 Jul 2025US 12,374,648 B2STMicroelectronics S,r.l.
- Semiconductor device1 Jul 2025US 12,347,756 B2Rohm Co., Ltd.
- Semiconductor device and methods of manufacturing semiconductor devices25 Mar 2025US 12,261,145 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device and method of manufacturing semiconductor device17 Sep 2026US 2026/0282921 A1Kabushiki Kaisha Toshiba
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Method of manufacturing a semiconductor package and such semiconductor package18 Jun 2026US 2026/0173938 A1Nexperia B. V.
- Clip for die top interconnection of power module applications21 May 2026US 2026/0144121 A1
- Substrate Clip with Sheet and Patterned Electrically Conductive Structure Having Different Thicknesses14 May 2026US 2026/0136948 A1
Most cited
By later US patents
- Wireless radio frequency power semiconductor devices using high density interconnect171US 5,637,922 AGeneral Electric Company · 1997
- Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells34US 8,636,198 B1SunPower Corporation · 2014
- Semiconductor device with uneven metal plate to improve adhesion to molding compound31US 6,849,930 B2NEC Corporation · 2005
- Lead-bond type chip package and manufacturing method thereof27US 6,423,622 B1Advanced Semiconductor Engineering, Inc. · 2002
- Prefabricated contacts for printed circuit card connectors23US 4,044,888 A1977