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US 2026/0144121 A1Published application
Clip for die top interconnection of power module applications
OwnerMuhammad Morshed, Maryam Khalilah Binti Mat +1inventors
InventorsMuhammad Morshed, Maryam Khalilah Binti Mat, Li Xiang
Life of this patent
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Abstract
An interconnection clip for a semiconductor package and semiconductor device or package comprising the same. The clip comprises a first metal and a second metal, wherein the first metal is copper and the second metal is tungsten or molybdenum; and one or more cavities provided on a first side of the clip, wherein the first side of the clip is configured for attachment to a die top of the semiconductor package.
Claims15
A clip for a semiconductor package, the clip comprising:
- a first metal and a second metal, wherein the first metal is copper and the second metal is tungsten or molybdenum;
- and
- one or more cavities provided on a first side of the clip, wherein the first side of the clip is configured for attachment to a die top of the semiconductor package.
Dependencies are inferred from the claim text.