H10W 72/631
Shapes of strap connectors
Official title: {Shapes of strap connectors}
H10W72/631 (Shapes of strap connectors) appears on 570 US grants and 742 published applications in this corpus.
Search patents in H10W- Granted patents
- 570
- Published applications
- 742
- Assignees
- 164
- Inventors
- 1,070
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 2 | 2 |
| 2002 | 6 | 6 |
| 2003 | 6 | 5 |
| 2004 | 7 | 7 |
| 2005 | 5 | 10 |
| 2006 | 4 | 11 |
| 2007 | 6 | 21 |
| 2008 | 8 | 9 |
| 2009 | 7 | 16 |
| 2010 | 15 | 18 |
| 2011 | 15 | 21 |
| 2012 | 18 | 23 |
| 2013 | 23 | 33 |
| 2014 | 19 | 36 |
| 2015 | 42 | 44 |
| 2016 | 45 | 35 |
| 2017 | 32 | 29 |
| 2018 | 26 | 32 |
| 2019 | 27 | 32 |
| 2020 | 29 | 59 |
| 2021 | 41 | 63 |
| 2022 | 40 | 47 |
| 2023 | 43 | 43 |
| 2024 | 32 | 53 |
| 2025 | 37 | 44 |
| 2026 | 20 | 43 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Chip package with contact clip8 Sep 2026US 12,730,135 B2Infineon Technologies AG
- Method of manufacturing semiconductor devices and corresponding semiconductor device11 Aug 2026US 12,707,994 B2STMicroelectronics S,r.l.
- Semiconductor device for upper and lower arm circuits21 Jul 2026US 12,690,471 B2Denso Corporation
- Package structure for power semiconductor devices with improved parasitic parameters21 Jul 2026US 12,690,495 B2Nexperia B. V.
- Semiconductor device and vehicle8 Oct 2026US 2026/0314464 A1Fuji Electric Co., Ltd.
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
- Frame module for a semiconductor integrated circuit, ic, as well as a power module comprising such a frame module and a method of manufacturing such a frame module10 Sep 2026US 2026/0271778 A1Nexperia B. V.
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
- Semiconductor device3 Sep 2026US 2026/0262546 A1Rohm Co., Ltd.
Most cited
By later US patents
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Semiconductor die package including drain clip136US 6,777,800 B2Fairchild Semiconductor Corporation · 2004
- Semiconductor device78US 6,774,466 B1Hitachi Tohbu Semiconductor, Ltd. · 2004