H10W 72/634
Cross-sectional shape
Official title: {Cross-sectional shape}
H10W72/634 (Cross-sectional shape) appears on 250 US grants and 344 published applications in this corpus.
Search patents in H10W- Granted patents
- 250
- Published applications
- 344
- Assignees
- 88
- Inventors
- 571
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 1 | 2 |
| 2006 | 0 | 1 |
| 2007 | 2 | 4 |
| 2008 | 1 | 1 |
| 2009 | 1 | 3 |
| 2010 | 3 | 2 |
| 2011 | 2 | 0 |
| 2012 | 0 | 6 |
| 2013 | 1 | 6 |
| 2014 | 5 | 13 |
| 2015 | 15 | 28 |
| 2016 | 29 | 18 |
| 2017 | 17 | 15 |
| 2018 | 12 | 20 |
| 2019 | 17 | 22 |
| 2020 | 18 | 40 |
| 2021 | 31 | 45 |
| 2022 | 26 | 22 |
| 2023 | 25 | 26 |
| 2024 | 16 | 23 |
| 2025 | 19 | 18 |
| 2026 | 9 | 28 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor devices and corresponding semiconductor device11 Aug 2026US 12,707,994 B2STMicroelectronics S,r.l.
- Semiconductor device and method for manufacturing semiconductor device19 May 2026US 12,635,533 B2Kabushiki Kaisha Toshiba
- Semiconductor device19 May 2026US 12,635,573 B2Rohm Co., Ltd.
- Metal clip applied to power module14 Apr 2026US 12,604,753 B2Hyundai Mobis Co., Ltd.
- Electrical connection element and correspond method and apparatus with outgassing grooves that remove trapped gasses14 Apr 2026US 12,604,774 B2Infineon Technologies AG
- Semiconductor device and vehicle8 Oct 2026US 2026/0314464 A1Fuji Electric Co., Ltd.
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
- Frame module for a semiconductor integrated circuit, ic, as well as a power module comprising such a frame module and a method of manufacturing such a frame module10 Sep 2026US 2026/0271778 A1Nexperia B. V.
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
- Semiconductor device3 Sep 2026US 2026/0262546 A1Rohm Co., Ltd.
Most cited
By later US patents
- Dual lead frame semiconductor package and method of manufacture20US 8,822,273 B2Vishay-Siliconix · 2014
- Semiconductor device having compliant and crack-arresting interconnect structure20US 9,496,208 B1Texas Instruments Incorporated · 2016
- Packaging solutions for devices and systems comprising lateral GaN power transistors20US 9,589,868 B2GaN Systems Inc. · 2017
- Packaged semiconductor device having multilevel leadframes configured as modules17US 9,177,945 B2Texas Instruments Incorporated · 2015
- Semiconductor package having dimpled plate interconnections15US 7,683,464 B2Alpha and Omega Semiconductor Incorporated · 2010