Semiconductor device and method for manufacturing semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorKyo Tanabiki
Life of this patent
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Abstract
According to one embodiment, a semiconductor device includes a bed portion, a semiconductor element, and a connector. The semiconductor element has a first electrode electrically connected to the bed portion and a second electrode facing away from the bed portion. The connector includes a first connection portion with a first surface electrically connected to the second electrode. The first surface is inclined in a direction from an outer edge portion of the first surface toward a center of the first surface. A lead portion of the connector is electrically connected to the first connection portion and spaced away from the bed portion.
Claims17
A semiconductor device, comprising:
- a bed portion;
- a semiconductor element including:
- a first electrode electrically connected to the bed portion, and
- a second electrode on a side of the semiconductor element opposite of the first electrode in a first direction;
- and
- a connector including:
- a first connection portion having a first surface electrically connected to the second electrode and a second surface opposite of the first surface, the first surface being at an upward incline from an outer portion towards a center of the first surface, and the second surface being a planar surface parallel to the second electrode, and
- a lead portion electrically connected to the first connection portion and separated from the bed portion, wherein
- the first surface has a pyramidal shape.
A semiconductor device, comprising:
- a bed portion;
- a lead frame connector having a first connection portion above the bed portion in a first direction and a lead-out portion that is spaced from the bed portion in a second direction intersecting the first direction;
- and
- a semiconductor element having a first surface side soldered to the bed portion and a second surface side soldered to the first connection portion, the semiconductor element including:
- a first electrode soldered to the bed portion, and
- a second electrode on the second surface side and soldered to the first connection portion, the second electrode being electrically connected to the lead-out portion via the first connection portion, wherein
- the first connection portion has a first surface facing the semiconductor element and a second surface facing away from the semiconductor element,
- the first surface has a rectangular outer shape,
- the first surface has a groove portion extending in a second direction from an outer corner portion of the rectangular outer shape of the first surface toward a center of the first surface,
- the second surface is parallel to the second surface side of the semiconductor element, and
- an upper surface of the groove portion is parallel to the second surface.
A method for manufacturing a semiconductor device, comprising:
- connecting a first electrode of a semiconductor element to a bed portion with solder;
- connecting a first portion of a connector to a second electrode of the semiconductor element with solder;
- and
- heating the semiconductor element, the bed portion, the connector and the solder to fix the bed portion and the first connection portion of the connector to the semiconductor element, wherein
- the first portion of the connector has a first surface facing the second electrode and second surface opposite the first surface,
- the first surface is at an upward incline from an outer portion towards a center of the first surface,
- the second surface is a planar surface parallel to the second electrode, and
- the first surface has a groove portion extending in a direction from the outer portion towards the center of the first surface.
Dependencies are inferred from the claim text.