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US 12,604,753 B2Granted
Metal clip applied to power module
AssigneeHyundai Mobis Co., Ltd.
InventorsSe Min Park, Ji Hye Jeong
Life of this patent
Estimating the term…
Abstract
A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom.
Claims13
A metal clip disposed on chips to connect the chips to each other, comprising:
- a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips;
- and
- an outer side part formed at each of the bonding parts to extend upward from an outermost edge portion of a respective one of the bonding parts such that a step is formed at the outermost part of the bonding part,
- wherein a lower portion of the outer side part includes a recessed s ace of cut-out formed therein.
1 more element
A metal clip disposed on chips to connect the chips to each other, comprising:
- a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips;
- and
- an outer side part formed at each of the bonding parts to extend upward from an outermost edge portion of a respective one of the bonding parts such that a step is formed at the outermost part of the bonding part,
- wherein one or more through holes penetrating through a connection part connecting two adjacent bonding parts of the plurality of bonding parts are formed in the connection part.
1 more element
Dependencies are inferred from the claim text.